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Intel strengthens position in packaging tech as TSMC scrambles to respond

Intel strengthens position in packaging tech as TSMC scrambles to respond
Crypto
1 month ago 9K Views 05 Comment 1.5k Share

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Google, Amazon, and Tesla are lining up for Intel's EMIB packaging, and TSMC is now building its own version to keep pace. Intel’s EMIB (Embedded Multi-die Interconnect Bridge) technology is emerging… [+1661 chars]

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